OUTLINES:
REMOVAL
RESIST RR-10B/13 consists of Vinyl-based resin principally, and designed as
thermosetting-type removable solder resist ink.
RR-10B/13 is applied by screen-printing, and the coated-film is able to
be peeled, such as with fingers easily after soldering process. No residue
remained and no need of post-treatment, such as rinsing on coated area that
after RR-10B/13 was removed.
APPLICATION
FIELDS:
Single-sided PCB and Double-sided Cu-thru-hole PCB.
CHARACTERISTICS:
|
ITEM |
TYPICAL VALUE |
MEASUREMENTS |
|
Color : State |
Blue (white, red) –colored paste |
--- |
|
Solid Content |
100.0wt% |
dried in an oven in 130℃ x 1hr. |
|
Specific Gravity (at 25℃) |
1.16 |
Specific Gravity Cup Method |
|
Viscosity( at 25℃) |
1000 ps |
Viscotester-VT-04 model |
|
Thixotropic Index |
6.0 |
Brookfield-HBT model |
|
Curing Condition |
130℃ x 10 min. |
In an oven |
|
Shelf (Pot) –Life |
about 2 months |
in normal tempt. (25℃) |
|
Surface Hardness |
2 H |
JIS D 0202 |
|
Adhesion |
100/100 |
JIS D 0202 |
|
Solder/Heat Resistance (260℃) |
5 sec.; pass |
rosin-based flux applied |
|
Insulation Resistance Test |
2.0 x 1011Ω |
JIS Z 3197 |
|
Corrosion Test |
pass |
JIS Z 3197; on copper |
|
Solvent Resistance |
pass |
Freon or Alcohol-based solvent |
DIRECTION FOR
USE:
1.
Stirring RR-10B/13 up completely before application.
2. Use as supplied without dilution.
3.
A 80-100 meshes polyester screen with emulsion thickness of 200μm would be recommend for
coating purposes.
4.
Make the thickness of the coated film at least 150μm and up. The thick of the coated-film
thickness, the better heat
resistance
can be obtained especially, when in hot-air levelling or reflow soldering,
coated-film.
5. The recommended curing condition is 130-140℃ x 10min. or up in an oven.
6. Use Ester-group or Halide-Carbon-group solvents to wash/rinse the
related tools after application.
7. Store
RR-10B/13 in a certain area with low temperature below 25℃, and avoid direct sunshine.
High temperature, e.g. over 40℃, will make 44-10B/13 gel
abruptly.
REFERENCE
DATA:
HEAT RESISTANCE; SOLVENT RESISTANCE
Printing Conditions: 80 meshes Polyester screen applied;
Emulsion Thickness: 200μm ;
Coated-Film thickness: 150μm .
|
|
ROSIN-BASED FLUX |
WATER-SOLUBLE FLUX |
||||
|
SOLDERING-TIME |
5 SEC. |
10 SEC. |
15 SEC. |
20 SEC. |
7 SEC. |
14 SEC. |
|
ON COPPER-FOLL |
○ |
○∼△ |
△∼╳ |
╳ |
○ |
○∼△ |
|
ON THRU-HOLE |
○ |
○ |
○ |
○∼△ |
○ |
○ |
★ A mixture-solder with 250℃ applied;
Evaluation: ○ ---pass; △ ---slihgt-melted; ╳ ---melted and
come-off
|
|
1.1.1.-TRICHLOROETHANE |
I.P.A. |
||||
|
DIPPING-TIME |
5 MIN. |
10 MIN. |
15 MIN. |
10 MIN. |
20 MIN. |
30 MIN. |
|
APPEARANCE CHANGE |
no change |
no change |
no change |
Whitish-flux-residues-retained; film-no change |
||
|
REMOVALABILITY |
○ |
○ |
○ |
○ |
○ |
○ |
★ A
rosin-based flux applied;
Dipped into
above-mentioned solvents at normal tempt. After soldering;
Soldering
conditions: 250 x 5 sec.
Evaluation:
○ ---pass; △ ---Film-Expanded; ╳ ---Inpeelable